Scholarship Details

Packaging Compliance Labs

Application Deadline:

11/12/2022

Requirements:

Packaging Engineers

Purpose:

Packaging Compliance Labs is offering a scholarship for packaging engineers for Winter 2022. The winner will be awarded a $2,000 scholarship towards their packaging engineering education. This scholarship is available for packaging engineering college students who are enrolled in any college/university with a packaging engineering program.

Eligibility:

To be eligible for the scholarship, applicant must:

Show proof of admission to their university and program*
Proof they have completed/accepted an internship/co-op with a medical device company/medical device packaging firm/related OR
Write an excerpt why you are interested in medical device packaging engineering
One entry allowed per person

Terms of Award:

Packaging Compliance Labs is offering a scholarship for packaging engineers for Winter 2022. The winner will be awarded a $2,000 scholarship towards their packaging engineering education. This scholarship is available for packaging engineering college students who are enrolled in any college/university with a packaging engineering program.

Verification

Before awarding the scholarship, we will require proof of 2/3 items listed in eligibility.
Letter of proof from the university admissions
Course list/schedule for the upcoming year
Letter/proof of internship/co-op acceptance
Once a winner is chosen and all forms of proof have been verified, PCL will mail the winner their check.
*Admission to a college/university and packaging program is the one item that is required

Please Submit:

On line submission. Entry thru link below

Online Application:

https://pkgcompliance.com/packaging-engineering-scholarship/